PICLS

Tool for real-time thermal simulation of printed circuit boards

Overview
PICLS is a thermal simulation tool which helps designers easily perform thermal simulation of PCBs. Even if you are unfamiliar with thermal simulation, you will obtain a simulation result without stress through the tool's easy and quick operation in 2D. You can import the data of a PCB created in PICLS to scSTREAM and HeatDesigner, that is, you can pass the analysis data seamlessly from the PCB design stage to the mechanical design stage.

Useful applications of PICLS

  • Troubleshooting thermal issues of current products
  • Examining thermal interferences of part layouts
  • Consider heat release changes depending on a wiring pattern (coverage ratio)
  • Examine the arrangement of thermal vias (e.g. location, number)
  • Examine the performance of a heat sink
  • Examine the size of a PCB
  • Examine the number of layers and the thickness of copper foil
  • Consider natural/forced air cooling
  • Consider radiant heat
  • Considering heatsinks (number of fins, size
  • Examining heat dissipation performances by connection to enclosure
  • Considering PCB mounting environment
  • External file interface



    External file interface
    You can import IDF 3.0 and Gerber data

    Learn more about Cradle CFD products and services at www.cradle-cfd.com

  • Consideration of simple enclosure

    Consideration of simple enclosure
    You can consider heat dissipation by connection to enclosure

  • Heatsink

    Heatsink
    You can allocate and display parts such as plate fins and heat dissipation plates

  • Library

    Library
    You can register and reuse created parts to the library


  • Cutting out a PCB

    Cutting out a PCB
    Create a PCB of arbitrary shape by cutting out

  • Preview

    Preview
    Check the layout of components in 3D

  • Setting wiring pattern coverage ratio

    Setting wiring pattern coverage ratio
    Specify the area by rectangle and polygon

  • Placing thermal vias

    Placing thermal vias
    Specify through hole and IVH
    Specify filled via

  • Setting mounting environment

    Setting mounting environment
    Mount horizontally/vertically
    Consider forced air cooling and radiation

  • Displaying each layer

    Displaying each layer
    Check each layer by selecting a focused layer

  • Real-time display

    Real-time display
    Check component translation in real time

  • Report output

    Report output
    Output analysis results as reports

  • Alert function

    Alert function
    You can check parts whose temperature is higher than threshold

  • Linking with thermo-fluid analysis

    Linking with thermo-fluid analysis
    Output CAB file for scSTREAM or HeatDesigner

Learn more about Cradle CFD products and services at www.cradle-cfd.com


PICLS Lite Free Download