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Hexagon: PICLS development background

Jun Eto discusses the development of PICLS: A simplified thermal analysis tool for PCB design engineers.

PICLS is a computational thermal analysis tool designed for PCB (printed circuit board) design engineers, who may have little experience with numerical analyses. Intended for simple and quick execution of thermal analyses, PICLS uses an intuitive two-dimensional interface that combines the Preprocessor for controlling analysis model settings and Postprocessor for displaying results into one. The goal was “to create greater benefit for PCB design engineers by allowing them to evaluate thermal design ideas easily on the spot.” Jun Eto from the Cradle Software Engineering Department provides a detailed account of the development.

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Our Privacy Notice describes how we process Personal Data about you. It also provides information on how you may exercise any of your rights as a Data Subject. You have the right to withdraw your consent at any time by clicking on the "Unsubscribe" link within the electronic marketing communications sent to you. By submitting this form, you agree to our Terms of Use.

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