Thermal analysis with MSC Nastran  

NAS104

Objective

This seminar describes the latest heat transfer and thermal stress analysis capabilities beginning with Version 68. Program inputs and interpretation of results for conduction, convection, and radiation analyses are covered in detail. The seminar attempts to provide a balance between theory, its development within the context of MSC Nastran, and practical application.Example problems are used to clarify the information presented


Content

  • MSC Nastran communication
  • Input data formats - Executive control statements
  • Case control statements - Parameter statements
  • Overview of heat transfer capabilities
  • Conduction - Convection - Radiation
  • The MSC Nastran thermal model
  • Geometry - grid points and elements - Material properties
  • Boundary conditions - surface elements - Thermal "loads"
  • Thermal transients
  • NASTRAN input data
  • Steady state analysis (SOL 153)
  • NLPARM statement - Free and forced convection
  • Thermal loads - Radiation boundary condition
  • Radiation view factors - Radiation enclosure analysis - Spectral exchange
  • Transient analysis (SOL 159)
  • TSTEPNL statement - Transient load methodology
  • Control nodes - Temperature boundary conditions - Phase change
  • Thermal stress analysis
  • Restarts
  • Multimode heat transfer analysis
  • Thermal system analysis
  • Miscellaneous topics


Prerequisites

Basic knowledge of heat transfer fundamentals. NAS101 or equivalent experience is recommended.


Dates

Instructor-led online:
06.06.2023-08.06.2023


Duration

3 days


Price

£1,350+VAT(Hexagon office)/£900+VAT(online)

Contact

Tel: +44 (0)1276 903120 
Email: MI-MSC-info.uk@hexagon.com